What do you try to solder?  The key components on your assembly usually got recommendation from your components' supplier.  E.g. Intel, TI application notes have reflow profile for the parts.  
--------------------------
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----- Original Message -----
From: Christopher Young [mailto:[log in to unmask]]
Sent: Tuesday, December 13, 2011 05:17 AM
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] Thermal profile for lead free

Hi all,

 

Could you give me some data on ideal temperature against ramp time for
lead free profile.

 

We have a 8 zone oven with profiles as follows. Are they both ok from a
solder process point.

 

At reflow zone Temp is at 220 c - 240c max for 30secs on one product. 

 

Any help or thoughts on thermal profiling would be great.

 

Regards

 

Chris 


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