thanks chris, outside of all that, whats your interpretation of 3.3.1 and 
its applicability to designs with metal to the edge.

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



Chris Mahanna <[log in to unmask]> 
Sent by: IPC-600-6012 <[log in to unmask]>
12/15/2011 09:21 AM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>


To
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Subject
Re: [IPC-600-6012] haloing






Unfortunately/fortunately, depending upon your perspective, fabricators 
are responsible for DfCM review.  This is my invented acronym for Design 
for Conformant Manufacturability; which means that the fabricator's 
front-end must not only be experts at the performance specifications, but 
ALSO the customer's interpretation of the specs and what they might agree 
to as AABUS.

Similar haloing issues have been a hot topic since laminate starting 
getting more brittle.  6012 has discussed at length, and come to an 
impasse because the "correct" answer is for the design activity and 
fabricator to sit together and iron it out  (AABUS).

There was a heated discussion about whether or not the fabricator should 
be responsible for reverse engineering the design, for the purpose of the 
risk assessment w.r.t. DfCM (this is what Pete is suggesting).  While this 
might be the most efficient solution, IMO it is inappropriate.

If I were the buyer, I would assume that there is haloing under the land, 
but accept this condition if there wasn't a biased node under that land 
(which there doesn't appear to be).

Chris

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: 2011/12/15 12:09 AM
To: [log in to unmask]
Subject: [IPC-600-6012] haloing

wondering how others interpret the applicability of 6012c 3.3.1 (and its
6018 equivalent) with respect to haloing, for designs that have metal to 
the edge of a pwb, as shown below?? conductor to conductor spacing is 
highly compliant, distance from the solder feature to the first halo along 
the edge is less than 4 mils.


to me 3.3.1 has a context where metal is away from the board edge by 
design, unlike the attached image.....
 
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896

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