Jack, that does help,  I have to think of this from another POV.

We don't do heavy copper, 2 oz at the very most, usually 1/2 - 1.  Where I run into questions is when I have 4 mil lines for my BGA but also have some higher current requirements.  Specifying 2 oz foil makes 4 mil lines tricky.  But all I really need is 2oz, I don't care how they get to that - for traces.  But if they start with 2 oz, and I get absolute minimum plating in a high current via, I may have a problem.

So maybe I'm back to the idea of specifying the foil as a 1/8 oz minimum with the final copper weight I actually need, and the plating in holes as another minimum.

I think you may have gotten me to my answer.

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