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November 2011

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Subject:
From:
Ahne Oosterhof <[log in to unmask]>
Reply To:
Date:
Thu, 17 Nov 2011 14:57:20 -0800
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Just a note: You don't use a 01005 to reduce the heat due to power to be
dissipated in the part. The allowed power in such a part is about 30mW.
Under the same conditions and using a 0201 part you are dissipating the same
amount of power and generating the same amount of heat.

Ahne.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, November 17, 2011 13:25
To: [log in to unmask]
Subject: Re: [TN] Success using 01005 parts?

Yes. There is no need for such a small size except perhaps in medical
applications or certain phone or special communications equipment.
(Implants, hearing aids, etc.). The other consideration is where an absolute
minimum of heat can be tolerated.

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Thursday, November 17, 2011 3:13 PM
To: TechNet E-Mail Forum; Stadem, Richard D.
Subject: RE: [TN] Success using 01005 parts?

Hi Mike,

I always argued that 01005 parts did not actually save enough space to
make them worth using (and won).  It is certainly true that they do not
save half the space even though they are thought of as half the size.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, November 17, 2011 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] Success using 01005 parts?

What specific problem are you having? Wetting, tombstoning, placement
issues?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Michael R. Floyd
Sent: Thursday, November 17, 2011 1:52 PM
To: [log in to unmask]
Subject: [TN] Success using 01005 parts?

Hello All:

 

Has anyone had any great success soldering 01005 parts? We have not.

 

Our manufacturing department has had us lowly pcb layout guys try about
every pad configuration/footprint layout to try and come up with one
that works well, reliably. We have used part & stencil manufacturer's
recommendations etc...etc....etc.... Nothing has seemed to work very
well. 

 

If you have had success, do you mind sharing your secret?

Please share your knowledge of:

PCB Footprint (pad sizes, pitch, mask or no mask between pads etc...)

Solder paste stencil opening size

Type of solder paste

Thickness of stencil

Reflow parameters (time, temp etc...)

 

Being that I am not a mfg. guy, I am sure that there may be a lot more
information that we need in order to be successful. I figured TechNet
would be as good a starting point as any for gathering the needed
information. The vast amount of knowledge, experience and comments that
are shared on this forum, never ceases to amaze me.

 

Thank you in advance for your suggestions, comments and horror stories.

 

Sincerely,

 

Mike

 

 

             Michael Floyd

       CAD/CAM Engineer

 

         Office Address:

         4393 Digital Way

         Mason, Ohio 45040

 

         Shipping Address:

         4240 Irwin Simpson Rd

         Mason, Ohio 45040

 

         513-204-7647 (Direct)

         513-204-7600 (Main)

         513-204-8999 (Main Fax)

   [log in to unmask] 

     www.L-3Com.com/Nova <http://www.l-3com.com/Nova> 

    Mon-Fri, 7:00 AM to 4:30 PM,

       alternating Friday's off

         (9/80 work system)

 


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