Beside the internal forces caused by the heated moisture there is the
oxidation rating, much faster with higher temp.
Do anyone have a graph of this rating (temp. per time per oxidation
thickness)? on PCB finish (Imm. Ag, Imm Sn, ENIG, OSP)?
Reuven
On Thu, Nov 17, 2011 at 6:28 PM, Garcia, Rigo (GSFC-300.0)[MANTECH SRS
TECHNOLOGIES] <[log in to unmask]> wrote:
> Good day TechNetters!
>
> I have been reading all sorts of materials regarding bakeout of boards and
> the consequences. Among some of the documents I've read is IPC-1601 -
> "Printed Board Handling and Storage Guidelines".
>
> One of the main questions I still have is, if moisture contributes to
> delamination by the internal forces generated internally on the PCB when
> heating up the board at high temperatures due to the evaporation of the
> water, why would anybody recommend temperatures above 100 °C which is the
> boiling temp for water? For instance, baking at 125 °C would create the
> same effects we are trying to avoid, wouldn't it?
>
> Does anybody know any good reading material to learn about this?
>
> Thanks for the help!
>
> Rigo Garcia
>
> Sr. Quality Assurance Engineer
> Workmanship Standards, Code 300
> NASA, Goddard Space Flight Center
> Greenbelt, MD 20771
> Phone. (301) 286-6129
> Fax. (301) 286-6576
>
>
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