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November 2011

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Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Mon, 14 Nov 2011 14:23:00 -0800
Content-Type:
text/plain
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text/plain (133 lines)
Here is a lot to learn about e-paper. Not for you actual quiz but to be
read for fun.
Inge
http://www.epapercentral.com/epaper-technologies-guide

On 14 November 2011 13:56, Inge Hernefjord <[log in to unmask]> wrote:

>
> Rocky,
> there are lots of 'it depends', as would say certain can opener.
> - What kind of product, commercial, MIL, Space, toys etc? These dictate
> the general  requirements
> - decide low moisture permeability level
> - decide mobile ions barrier
> - decide level of repair ability
> - decide level of encapsulant purity
> - decide the dielectric constant to match the propagation delay
> requirements
> - decide the vulnerability against alfa particles (some semis are)
> - decide the thermal conductivity
> - surface tension (vs encapsulant)
> -decide warpage
> -others may fill in...lots
>
> To use Pertinax or CEM is maybe not an easy task for unexperienced
> designers, but could be a good idea if you got money and time and lots of
> go in you. I don't belong to the rigid who say No to every unusual
> proposal. You have probably seen the 'computers' built on paper and which
> can be rolled and put in a tube. So, why not make a try. Personally, i know
> little about paper substrates.
>
> So, it's not easy to give a precise advice not knowing the expected final
> product.
> I was engaged in COB twenty years ago, very amusing job. There is a lot of
> litterature about COB, one very good book is this one:
> Chip On Board edited by John H. Lau ISBN 0-442-014441-4  Van Nostrand
> Reinhold NY
>
> Good Luck
>
> Inge
>
>
>
> On 14 November 2011 14:25, Joyce Koo <[log in to unmask]> wrote:
>
>> BT
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Rocky Wang
>> Sent: Monday, November 14, 2011 3:22 AM
>> To: [log in to unmask]
>> Subject: [TN] PCB substrate material choose for COB product
>>
>> Hello Technetters;
>>           If there anybody has the knowledge to choose the PCB substrate
>> material (Paper board, CEM, FR-4) for COB product?   For sure FR4 will be
>> the best. However, why in some case, Paper material work, and in some case,
>>  go to CEM material. If there have some choose guideline, such as from the
>> die bonding pad size, pad pitch, number of bonding wire, and the size of
>> the bonding wire or other conditions?
>>
>> Best Regards
>> Rocky
>>
>>
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