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November 2011

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Subject:
Re: PCB substrate material choose for COB product
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Mon, 14 Nov 2011 08:25:24 -0500
Content-Type:
text/plain
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text/plain (48 lines) 
BT

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rocky Wang
Sent: Monday, November 14, 2011 3:22 AM
To: [log in to unmask]
Subject: [TN] PCB substrate material choose for COB product

Hello Technetters;
           If there anybody has the knowledge to choose the PCB substrate material (Paper board, CEM, FR-4) for COB product?   For sure FR4 will be the best. However, why in some case, Paper material work, and in some case,  go to CEM material. If there have some choose guideline, such as from the die bonding pad size, pad pitch, number of bonding wire, and the size of the bonding wire or other conditions?

Best Regards
Rocky


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