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November 2011

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Subject:
From:
Rocky Wang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rocky Wang <[log in to unmask]>
Date:
Mon, 14 Nov 2011 16:22:05 +0800
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Hello Technetters;
           If there anybody has the knowledge to choose the PCB substrate material (Paper board, CEM, FR-4) for COB product?   For sure FR4 will be the best. However, why in some case, Paper material work, and in some case,  go to CEM material. If there have some choose guideline, such as from the die bonding pad size, pad pitch, number of bonding wire, and the size of the bonding wire or other conditions?

Best Regards
Rocky


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