Thanks, Dave.

I think the benefit we were looking for (reducing the galvanic reaction with the module we are bolting the board to)
can be achieved with Immersion Silver as well. All things considered, that option seems less risky...

Thanks also to everyone else who responded, I appreciate it.

Anyone else have to deal with galvanic considerations in their mounting schemes?

surfin' the learnin' curve,
Jack  


.
On Mon, 31 Oct 2011 15:32:31 -0500, David D. Hillman <[log in to unmask]> wrote:

>Hi Jack - some immersion tin plating chemistries have been show to produce
>tin whiskers - but not all. The test data concerning this topic is
>considered by most companies to be " proprietary" so I recommend you
>discuss the tin whisker issue with the specific immersion tin plating
>chemistry supplier and request what data they have for their material. If
>they don't seem to have such data, that response would be a factor to
>consider. Good Luck.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------