MHO/2 cents:

SN96 selective soldering: The wave will wash off the 387 and replace it with
SN96
Sn96 hand: You will end up with a lower Ag/Cu SAC (compared to 387). 
Nit picking detail: This will have slightly different properties with
respect to thermal cycling and mechanical properties. Probably these will be
of no significance except in extreme cases. See the literature comparing
different SACS/test regimes.

Sn63 selective: As before the wave will wash away the 387 and you will have
Sn63, maybe a little Ag in the intermetallic bondline, no significance I
would say
Sn63 hand: As you say you will need to flow at above the MP of the 387 to
achieve uniformity in the joint. Probably difficult not to do that.


Regards

Mike Fenner 
Bonding Services & Products
T: +44 [0] 1865 522 663 
M: +44 [0] 781 052 6317 
E: [log in to unmask]

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerald Bogert
Sent: Wednesday, November 09, 2011 7:56 PM
To: [log in to unmask]
Subject: [TN] Soldering SAC387 connector solder tails using Sn96 Solder or
Sn63 solder

November 9, 2011

 

Is there any technical concern with hand or selective soldering a
surface mount connector with SAC387 solder tails to a CCA using Sn96
solder; both alloys melt around 221C?

 

Is there an technical concern with reflow or selective soldering this
connector using Sn63 solder?  I am aware that there can be compatibility
issues soldering Sn63 to some SAC alloys unless the reflow soldering
profile temperature is high enough to ensure complete melting of SAC
alloy.  

 

[log in to unmask]

 

 


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