Agree. The FAB point of view if you pass the flyprobe, cross section of line width for conductor, (if you really want, add thermal shock to stress the via), Tg, CTE are checked, it would consider done. Any design flaw, such as un-balanced board, delay, impedance mis-match, are not FAB problem. (can't be fixed at FAB level anyhow... ). My 1 penny. Assembly should within the design intended process window (what ever that is without damage the product).
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Wednesday, November 09, 2011 4:24 PM
To: [log in to unmask]
Subject: Re: [TN] Qualification of PWB Suppliers...
From an initial design/release of a printed board, I would say no for
those who incorporate sufficient rigor in the design release process.
Transitioning of legacy product to new Suppliers may warrant additional
assembly level assessment.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Balchunas
Sent: Wednesday, November 09, 2011 1:24 PM
To: [log in to unmask]
Subject: [TN] Qualification of PWB Suppliers...
All,
Does Final Assembly and Functional Testing add value to Qualifying Bare
Board PWB Suppliers?
Put another way...is a Supplier's Continuity/Isolation/Controlled Z
Testing, and their Customer's Inspection of the Physical Product to its
Documentation, sufficient to Qualify the Supplier without additional
Assembly or Functional Testing?
Thanks in advance for sharing your experiences with this.
John Balchunas
Supplier Quality Engineer
Email: [log in to unmask] <mailto:[log in to unmask]>
Tel: 763-278-2249
Fax: 763-767-4635
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