Thanks to all that replied. I got a lot of good information to go after the supplier from it.
Regards,
Amol Kane | Process Engineer
Catalyst Manufacturing Services, Inc.
941 Route 38, Owego NY 13827
Phone: (607) 687-7669 Extn 349 | Website: www.catalystems.com
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Monday, October 31, 2011 9:50 AM
To: TechNet E-Mail Forum; Amol Kane
Subject: RE: maximum height of artifacts above the soldermask
Amol, you are correct, I have run into the same issue. Our board fabricator took steps to correct this issue after it was discovered, and our paste printing issues disappeared. It can be done.
dean
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Amol Kane
Sent: Friday, October 28, 2011 7:45 AM
To: [log in to unmask]
Subject: [TN] maximum height of artifacts above the soldermask
Dear Technetters,
Is there a spec/guidance/industry best practice recommendation on the maximum height of artifacts (like silkscreen, via tents etc.,) above the soldermask surface?. Assuming the stencil foil sits squarely on the soldermask, any height above that will induce a (localized) standoff if any such artifact is near the pad. We have some boards in which the via tents are 7 mils above the rest of the mask surface. Some of these vias are close to fine pitch devices. I am afraid that I won't be able to control the volume of paste during printing leading to shorts. The board house saying I won't have an issue (big surprise there! :)). Is there something I can use as a basis of my push back ?
Thanks in advance!!
Amol Kane | Process Engineer
Catalyst Manufacturing Services, Inc.
941 Route 38, Owego NY 13827
Phone: (607) 687-7669 Extn 349 | Website: www.catalystems.com<http://www.catalystems.com/>
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