Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Mon, 7 Nov 2011 14:43:03 -0500 |
Content-Type: | text/plain |
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Fellow Designers -
I have a question about Wrap Plating. This comes up from time to time,
we have a vendor indicating that he needs a waiver on a wrap plating
requirement due to constraints of this board design. The board is a type
IV (.062 thick) and has Blind and thru vias. The via is .006 thru with a
.022 pad, the vendor indicates the requirement must be waived due to the
.004 spacing on the design.
Any thoughts or feedback appreciated.
Thanks,
Don
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