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November 2011

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Tue, 1 Nov 2011 23:18:01 +0000
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TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
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Louis Hart <[log in to unmask]>
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Technetters, my question deals with the number of microsections of blind or buried vias, per panel, required by IPC-6012.

For plated holes, one thermally stressed A/B coupon is required per panel. A second A/B coupon, from the corner opposite to that from which the thermally stressed one was taken, is required to be microsectioned in a direction perpendicular to that of the first per panel to check internal annular ring. (I have not been calling for thermal stress of the second A/B.)

Does 6012 require a second microsection coupon for blind and buried vias? (I have collected a number of opinions, and have one of my own.)

I have noticed that MIL-PRF-55110 does not require a second blind or buried vias. As I read it, the requirement is for a single coupon per panel, thermally stressed, for each blind of buried via. MIL-PRF-31032 does not, it appears to me, explicitly address the number of blind and buried microsections required.

Thanks for any comments or insight.

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1272

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