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October 2011

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Wed, 12 Oct 2011 08:49:53 -0500
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You might want to look at the new publication (March 2011) of IPC-7093,
"Design and Assembly Process Implementation for Bottom Terminated Components".
It won't resolve all of the issues for you, but it is a good introduction.

Some of the Technet members were on the committee that developed it;
Have any of you come across mistakes or weaknesses or addendum?

surfin' the learnin' curve,
Jack


.
On Tue, 11 Oct 2011 10:39:18 -0400, Karen Tellefsen <[log in to unmask]> wrote:

>How does one do these calculations, what are the rules?
>
>Is there a web site that can provide guidance?  QFN's are difficult to
>solder well
>
>Karen Tellefsen - Electrical Testing
>[log in to unmask]
>908-791-3069
>

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