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October 2011

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Subject:
From:
Amol Kane <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Amol Kane <[log in to unmask]>
Date:
Wed, 12 Oct 2011 07:29:03 -0400
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Inge, this method would only be suitable for tinning wires... yes?

Or is this fair game for leads of active components since only the leads are inserted in the solder pot (unlike an ultrasonic stencil cleaner for cleaning misprinted boards with one side populated where the entire assembly is exposed to ultrasonic energy?)

Thanks!


Amol Kane | Process Engineer
Catalyst Manufacturing Services, Inc.
941 Route 38, Owego NY 13827
Phone: (607) 687-7669 Extn 349 | Website: www.catalystems.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Wednesday, October 12, 2011 6:27 AM
To: [log in to unmask]
Subject: Re: [TN] Wire soldering question

Keith,

soldering to Nickel is not difficult. Soldering to Nickel oxide is 
difficult. There is the solution to your problem: removal of oxide.

I had exactly same problem as you many  years back. I solved the problem by 
dipping the dismantled end of the wires in a ultrasonic solder pot. You need 
just a small one. I demonstrated the efficiency of that method by picking 
som old and dirty nickel coins from my pocket and dip them directly without 
any cleaning. People marvelled by the good solder wetting. How come? The 
ultrasonic shock waves break the oxides and expose fresh nickel.

Example on a small U/S soldering pot: 
http://www.advancedsonics.com/newpage5%20USP.htm

My two nickels

Inge


----- Original Message ----- 
From: "Keith Calhoun" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 11, 2011 9:55 PM
Subject: [TN] Wire soldering question



We are building a small assembly for one of our customers using
M22759/12-24 wires, (nickel plated copper, Teflon insulated).  We are
using Multicore HMP solder, (Sn5, Pb93.5, Ag1.5) for this assembly.

Do any of you have a recommendation for a flux that may help in getting
this wire to wet?  The other solder joints are acceptable, we just can't
get the wire to wet.  I know that I am trying something difficult, as
soldering to nickel is difficult at best.  I would be most greatful for
any suggestions that anyone has for this.

Thanks for the excellent resource!

Keith S. Calhoun
Manufacturing Engineering Manager
SoPark Corporation
3300 South Park Avenue
Buffalo. New York 14218
Phone: 716-822-0434 ext. 237
Fax: 716-822-5062
[log in to unmask]
Thank you for helping SoPark reach our 30th year as a Premier
Electronics Manufacturing Service Provider!
ISO 9001:2008 & AS9100B Certified


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