TECHNET Archives

October 2011

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Wed, 12 Oct 2011 13:59:43 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (110 lines)
Who says that halides are no longer our friends? Those who don't know 
how to throw them out when they have outstayed their welcome! I'm no 
longer in the business, but, if I were, I would judiciously use halogens 
to flame-retard laminates, in tin/solder fluxes and maybe in solvents 
and I'm damn sure the reliability of my products would not be 
compromised in any way, compared to the results produced by my brethren 
who shun everything in column VIIB.

It always used to tickle me when the great vogue in Germany was to use 
DIN 8511 F-SW-32 (halide-free) fluxes and then to use chlorofluorocarbon 
113 solvent in a vain attempt to remove the residues, leaving a visible 
white residue of the acid activators. I have seen the lack of 
reliability of such assemblies on many occasions and it was nothing to 
do with the solvent containing three atoms each of fluorine and chlorine 
in each molecule. It was much more to do "halogenidfrei" being a 
buzzword in an industry that understood nothing that smacked of chemistry.

Brian

On 11/10/2011 23:33, Whittaker, Dewey (EHCOE) wrote:
> Instead of flux try scare tactics. Threaten to have Doug do the
> soldering. The wires will probably wet themselves.
> Back when Halides were our friends, I used a pre-tinning flux (Kester, I
> think) designed for silver finishes. It worked great.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Keith Calhoun
> Sent: Tuesday, October 11, 2011 12:56 PM
> To: [log in to unmask]
> Subject: [TN] Wire soldering question
>
>
> We are building a small assembly for one of our customers using
> M22759/12-24 wires, (nickel plated copper, Teflon insulated).  We are
> using Multicore HMP solder, (Sn5, Pb93.5, Ag1.5) for this assembly.
>
> Do any of you have a recommendation for a flux that may help in getting
> this wire to wet?  The other solder joints are acceptable, we just can't
> get the wire to wet.  I know that I am trying something difficult, as
> soldering to nickel is difficult at best.  I would be most greatful for
> any suggestions that anyone has for this.
>
> Thanks for the excellent resource!
>
> Keith S. Calhoun
> Manufacturing Engineering Manager
> SoPark Corporation
> 3300 South Park Avenue
> Buffalo. New York 14218
> Phone: 716-822-0434 ext. 237
> Fax: 716-822-5062
> [log in to unmask]
> Thank you for helping SoPark reach our 30th year as a Premier
> Electronics Manufacturing Service Provider!
> ISO 9001:2008&  AS9100B Certified
>
>
> ______________________________________________________________________
> This email has been scanned by the MessageLabs Email Security System.
> For more information please contact helpdesk at x2960 or
> [log in to unmask]
> ______________________________________________________________________
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 16.0
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> For additional information, or contact Keach Sasamori at [log in to unmask]
> or 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ______________________________________________________________________
> This email has been scanned by the MessageLabs Email Security System.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 16.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2