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October 2011

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Subject:
From:
Gerald Bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 11 Oct 2011 14:15:53 -0400
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October 11, 2011

As others have stated, any ORH1 flux is bad news unless in a perfect
world it is completely removed by the post soldering cleaning process
but as folks know we do not live in a perfect world.  Also, the go
forward fix to just make larger access holes in the gasket may not
prevent flux residue from traveling under the gasket.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Monday, October 10, 2011 7:49 PM
To: [log in to unmask]
Subject: [TN] ORH1 flux residues

I have a PWA with a gasket beneath a large thru hole power device.  
The gasket has holes punched in it for each of the pins. 
The device is hand soldered flush to the PWB.  
The operator uses external liquid flux along with core solder with flux
in it.  
The assembly is later washed and it passes ionics testing.  

The problem is that this gasket effectively seals the top side solder
connections from the cleaning process.  


My question is this:

How much should I be worrying about the existing hardware which has flux
residues sealed under the power device?
The assembly is stored with the power off.
The flux used is water soluble and classified as ORH1.
For future builds we are modifying the gasket so that the topside
connections can be cleaned (cutout "u" shape intead of round holes).



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