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Date: | Tue, 11 Oct 2011 00:34:03 -0500 |
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We've used a process that added an entire stencillng process to the back side before wave solder, which eliminated the skips with wave solder-only. Stencil, paste, glue, reflow, then topside, then wave. Current limits with gluing small parts and larger parts on the bottom have driven us to selective wave pallets instead. Haven't used a production process tacking manually, which sounds rather low on the manufacturability scale.
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