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October 2011

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Subject:
From:
Robert Kondner <[log in to unmask]>
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Date:
Mon, 10 Oct 2011 20:12:12 -0400
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I would suggest it is VERY bad thing.

 If that flux is an ionic material, and I think the H1 indicates it is, then
you have a serious problem with everything you ever built using that
technique. That flux, remaining on a PCB, and in the presence of a voltage,
will grow all kinds of evil stuff.

 I hope someone can tell me wrong. 

Bob K.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Monday, October 10, 2011 7:49 PM
To: [log in to unmask]
Subject: [TN] ORH1 flux residues

I have a PWA with a gasket beneath a large thru hole power device.  
The gasket has holes punched in it for each of the pins. 
The device is hand soldered flush to the PWB.  
The operator uses external liquid flux along with core solder with flux in
it.  
The assembly is later washed and it passes ionics testing.  

The problem is that this gasket effectively seals the top side solder
connections from the cleaning process.  


My question is this:

How much should I be worrying about the existing hardware which has flux
residues sealed under the power device?
The assembly is stored with the power off.
The flux used is water soluble and classified as ORH1.
For future builds we are modifying the gasket so that the topside
connections can be cleaned (cutout "u" shape intead of round holes).



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