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Subject:	ORH1 flux residues
From:	Phil Bavaro <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Mon, 10 Oct 2011 16:49:06 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

I have a PWA with a gasket beneath a large thru hole power device.
The gasket has holes punched in it for each of the pins.
The device is hand soldered flush to the PWB.
The operator uses external liquid flux along with core solder with flux
in it.
The assembly is later washed and it passes ionics testing.

The problem is that this gasket effectively seals the top side solder
connections from the cleaning process.

My question is this:

How much should I be worrying about the existing hardware which has flux
residues sealed under the power device?
The assembly is stored with the power off.
The flux used is water soluble and classified as ORH1.
For future builds we are modifying the gasket so that the topside
connections can be cleaned (cutout "u" shape intead of round holes).

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