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October 2011

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 10 Oct 2011 07:21:20 -0700
Content-Type:
text/plain
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text/plain (130 lines)
Dave,

The good news is Doug won't be soldering, because his methods are
tactless.

The bad news is it depends on the following:

*         a skilled and trained operator

*         component geometries

*         land pad relationships

*         orientation to flow

*         thermal dynamics of the design

*         volumetric deposition differences

*         fixturization, or the lack thereof

*         reflow profile

*         common sense

 

It can be successfully done and meet Aerospace requirements.

Dewey

 

 

 

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Sunday, October 09, 2011 7:33 PM
To: [log in to unmask]
Subject: [TN] The Use of Tack Soldering

 

Hi folks! I am looking for your opinions and information on tack
soldering 

for holding components in position for wave or selective soldering 

processes. I know that tack soldering can result in some void and/or 

insufficient solder joint defects. Does any know of any published
studies 

on tack soldering or have any experiences they can share? If you do use 

tack soldering, is there any technique or tack configuration that you
use 

that eliminates/reduces defects? 

 

TIA

 

Dave Hillman

Rockwell Collins

[log in to unmask]

 

 

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