We have found whiskers from the sac 405 and 305 solders. And Celestica published a paper on there experiments last year showing whiskers on solder joints as well.
Terry Munson
Foresite
765-457-8095
On Oct 28, 2011, at 4:52 PM, Joyce Koo <[log in to unmask]> wrote:
> It depends....
> http://www.atotech.com/data/publications/pcb/Immersion_Tin-Kinetics_of_Whisker_growth.pdf
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
> Sent: Friday, October 28, 2011 4:19 PM
> To: [log in to unmask]
> Subject: [TN] Whiskers from Immersion Tin Finish?
>
> I've always been under the impression that the risk of Tin Whiskers was
> mostly from the portion of component leads that don't get wetted with
> solder. (for example, a right-angle through hole connector may have exposed
> leads ABOVE the solder joint area)
>
> Now I'm being asked about the risk of whiskers from Immersion Tin finish in
> areas that don't get soldered, like vias, or lands of components that don't
> get populated. I haven't heard any of you talking about that, is this a
> risk?
>
> My first response was "naw, don't worry about it..",
> but then I turned to IPC-4554 and see a whole section (3.9) on "Whisker
> Issues"
> with Tables
> and Beautiful Photographs
> and advice on Measuring them,
> and methods of Rating them,
> and on and on...
>
> SERIOUSLY?
>
> (sigh)
>
> Jack
>
>
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