I've always been under the impression that the risk of Tin Whiskers was
mostly from the portion of component leads that don't get wetted with
solder. (for example, a right-angle through hole connector may have exposed
leads ABOVE the solder joint area)

Now I'm being asked about the risk of whiskers from Immersion Tin finish in
areas that don't get soldered, like vias, or lands of components that don't
get populated. I haven't heard any of you talking about that, is this a
risk?

My first response was "naw, don't worry about it..",
but then I turned to IPC-4554 and see a whole section (3.9) on "Whisker
Issues"
with Tables
and Beautiful Photographs
and advice on Measuring them,
and methods of Rating them,
and on and on...

SERIOUSLY?

(sigh)

Jack


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