Robert:

You have protected the PCBA from ESD damage and physical damage with the antistatic bubble wrap. Unless they are very heavy PCBAs or have projections on them that would warrant making a change, I don't see the need. You have the case of people's opinion and in the ESD world that usually gets more traction than facts. 

I have attached MIL-HDBK-773 for your reference which does detail such packaging requirements (Pg 19) but does not reference vertically stacking. (Sorry those I technet as I know the attachment will be stripped off). I don't know if this handbook has been canceled or not. 

Gregg Owens | Sr. Technical Writer
Wavestream Corporation
 (909) 599-9080 x 484 | [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert DeQuattro
Sent: Tuesday, October 04, 2011 6:57 AM
To: [log in to unmask]
Subject: [TN] PCBA Packaging Standards

Does anyone know what the standards are for packaging printed circuit board assemblies.  We have been packaging pcba's for years by placing in static bag, wrapping in antistatic bubble wrap and placing in a carton laying flat on top of one another.  We now have a customer that is saying this does not comply with industry or international standards and that, without going into specifics, the assembled boards should be packed upright.  I have done brief google searches and do not get any concise information.  I figured fielding this question to the technet would yield better results.

Thanks,

Bob DQ



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