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October 2011

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Subject:
From:
Robert DeQuattro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Robert DeQuattro <[log in to unmask]>
Date:
Tue, 4 Oct 2011 18:53:26 +0000
Content-Type:
text/plain
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text/plain (135 lines)
Based on responses from Technet subscribers, as a summary, it appears that there is no industry standard for PCBA packaging configuration, or method.  Naturally, we are aware of the ESD protection requirements (static shielding bag / antistatic bubble wrap etc...).  But in terms of how to put this packaged PCBA in a shipping carton, it appears to be one of choice, or customer specified requirement.  Thanks to all whom have provided input.  The technet continues to be a valuable resource for those of us in electronic related industries.

Bob DQ

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
Sent: Tuesday, October 04, 2011 2:14 PM
To: [log in to unmask]
Subject: Re: [TN] R: [TN] PCBA Packaging Standards

You can use also directive 94/ 62/ EC for packaging and packaging waste
Reuven

On Tue, Oct 4, 2011 at 7:56 PM, SALA GABRIELE <[log in to unmask]> wrote:

> This is not a standard but an interesting document
>
>
> http://www.isola-group.com/docs/downloads/TechnicalBulletinleadfreeprocedure
> s091207.pdf
>
> Gabriele
>
> -----Messaggio originale-----
> Da: TechNet [mailto:[log in to unmask]] Per conto di Robert DeQuattro
> Inviato: marted́ 4 ottobre 2011 15.57
> A: [log in to unmask]
> Oggetto: [TN] PCBA Packaging Standards
>
> Does anyone know what the standards are for packaging printed circuit board
> assemblies.  We have been packaging pcba's for years by placing in static
> bag, wrapping in antistatic bubble wrap and placing in a carton laying flat
> on top of one another.  We now have a customer that is saying this does not
> comply with industry or international standards and that, without going
> into
> specifics, the assembled boards should be packed upright.  I have done
> brief
> google searches and do not get any concise information.  I figured fielding
> this question to the technet would yield better results.
>
> Thanks,
>
> Bob DQ
>
>
>
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-- 

Best Regards,

*Reuven Rokah*

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