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October 2011

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Subject:
From:
John Balchunas <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Balchunas <[log in to unmask]>
Date:
Thu, 27 Oct 2011 14:19:40 -0500
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Is a Scuff or Scratch on the oxide ruled out?

 

John Balchunas

Supplier Quality Engineer

Email: [log in to unmask]

Tel: 763-278-2249

Fax: 763-767-4635

 

 

From: Ian Hanna [mailto:[log in to unmask]] 
Sent: Thursday, October 27, 2011 1:17 PM
To: TechNet E-Mail Forum; John Balchunas
Subject: Re: [TN] Delam or Inner Core Bond Enhance Anomaly or something
else?

 

are you able to view it under magnification at an area where the
inner-layer copper terminates? say the clearances around those two
plated holes?   this may give strong clues -- delam will continue even a
small way beyond the limit of the copper -- oxide marks obviously  not
cheers -- ian 



From: 

John Balchunas <[log in to unmask]> 

To: 

<[log in to unmask]> 

Date: 

27/10/2011 11:09 AM 

Subject: 

[TN] Delam or Inner Core Bond Enhance Anomaly or something else? 

Sent by: 

TechNet <[log in to unmask]>

 

________________________________




Good Morning and Your help is appreciated to figure out what a
discoloration is under the solder mask of a bare board which does not
change after one reflow temperature cycle.



The Prebake and Postbake photos are in my PCB Inspection Photos Gallery
at the TechNet Group Site 
http://ipc-technet.groupsite.com/galleries?page=3
<http://ipc-technet.groupsite.com/galleries?page=3> 



What is it?... Delam, or Inner Core Bond Enhance Anomaly, or something
else...?



Thanks for your help with this.



John Balchunas

Supplier Quality Engineer

Email: [log in to unmask] <mailto:[log in to unmask]
<mailto:[log in to unmask]> > 

Tel: 763-278-2249

Fax: 763-767-4635






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