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Date: | Thu, 27 Oct 2011 14:19:40 -0500 |
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Is a Scuff or Scratch on the oxide ruled out?
John Balchunas
Supplier Quality Engineer
Email: [log in to unmask]
Tel: 763-278-2249
Fax: 763-767-4635
From: Ian Hanna [mailto:[log in to unmask]]
Sent: Thursday, October 27, 2011 1:17 PM
To: TechNet E-Mail Forum; John Balchunas
Subject: Re: [TN] Delam or Inner Core Bond Enhance Anomaly or something
else?
are you able to view it under magnification at an area where the
inner-layer copper terminates? say the clearances around those two
plated holes? this may give strong clues -- delam will continue even a
small way beyond the limit of the copper -- oxide marks obviously not
cheers -- ian
From:
John Balchunas <[log in to unmask]>
To:
<[log in to unmask]>
Date:
27/10/2011 11:09 AM
Subject:
[TN] Delam or Inner Core Bond Enhance Anomaly or something else?
Sent by:
TechNet <[log in to unmask]>
________________________________
Good Morning and Your help is appreciated to figure out what a
discoloration is under the solder mask of a bare board which does not
change after one reflow temperature cycle.
The Prebake and Postbake photos are in my PCB Inspection Photos Gallery
at the TechNet Group Site
http://ipc-technet.groupsite.com/galleries?page=3
<http://ipc-technet.groupsite.com/galleries?page=3>
What is it?... Delam, or Inner Core Bond Enhance Anomaly, or something
else...?
Thanks for your help with this.
John Balchunas
Supplier Quality Engineer
Email: [log in to unmask] <mailto:[log in to unmask]
<mailto:[log in to unmask]> >
Tel: 763-278-2249
Fax: 763-767-4635
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