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October 2011

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Subject:
From:
Ian Hanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ian Hanna <[log in to unmask]>
Date:
Thu, 27 Oct 2011 14:17:21 -0400
Content-Type:
text/plain
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text/plain (92 lines)
are you able to view it under magnification at an area where the 
inner-layer copper terminates? say the clearances around those two plated 
holes?   this may give strong clues -- delam will continue even a small 
way beyond the limit of the copper -- oxide marks obviously  not cheers -- 
ian 



From:
John Balchunas <[log in to unmask]>
To:
<[log in to unmask]>
Date:
27/10/2011 11:09 AM
Subject:
[TN] Delam or Inner Core Bond Enhance Anomaly or something else?
Sent by:
TechNet <[log in to unmask]>



Good Morning and Your help is appreciated to figure out what a
discoloration is under the solder mask of a bare board which does not
change after one reflow temperature cycle.

 

The Prebake and Postbake photos are in my PCB Inspection Photos Gallery
at the TechNet Group Site 
http://ipc-technet.groupsite.com/galleries?page=3

 

What is it?... Delam, or Inner Core Bond Enhance Anomaly, or something
else...?

 

Thanks for your help with this.

 

John Balchunas

Supplier Quality Engineer

Email: [log in to unmask] <mailto:[log in to unmask]> 

Tel: 763-278-2249

Fax: 763-767-4635

 

 


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