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October 2011

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Wed, 26 Oct 2011 10:03:25 -0700
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You know this from a cross-sectional view of their capabilities?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, October 26, 2011 9:55 AM
To: [log in to unmask]
Subject: Re: [TN] Discoloration on plated over vias

A set of microsections directly through some of the affected pads will reveal the thickness of the nickel, and may also reveal information on any hole-fill epoxy smear, lack of planarization, or other fabrication issues that may have caused the root problem; inability to plate the nickel properly.
The way to do this is to microsection the edge of the pad, wet-etch in weak acid, coat in hard, clear epoxy, photograph, microsection again further into the pad, repeat the process and photograph again, etc., until you have at least 4 sectional views.
Most good analysis shops can do this for you. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev
Sent: Wednesday, October 26, 2011 11:42 AM
To: [log in to unmask]
Subject: Re: [TN] Discoloration on plated over vias

Hi Ioan,

Careful EDS may be able to tell. 
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Wed, 26 Oct 2011 12:21:14 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Ioan Tempea
	<[log in to unmask]>
Subject: Re: [TN] Discoloration on plated over vias

Once again, thanks everybody for the replies on my problem below.

 

I got one more question:

What test method would indubitably determine if the orange spots are Cu that surfaced?

 

Thanks,

 

Ioan Tempea

 

 

 

 

Dear Technos,

 

I got this issue, see http://ipc-technet.groupsite.com/gallery/21662

 

So 6 layer, 2oz Cu per layer PCB, epoxy filled vias and plated over. After assembly we see 4-5 vias having reddish stains, on most boards. Had it analyzed, no trouble with via integrity, no cracks in cover plating, no migration of fluids from inside out. FTIR does not detect any surface contamination.

 

Au plating thickness stands at 2.09 micro inches.

 

Nothing special detected in the stains, so the lab concluded what we see is an optical effect due to a certain roughness of the Cu. The logical conclusion is no issue, cosmetic defect.

 

However, our end customer, high reliability, want to know what the stains are and want absolute confirmation that long term reliability is not affected. Also, we've been warned that no such issues will be tolerated on future lots.

 

My questions to your infinite knowledge is: have you seen this before? How can I convince the customer everything is OK? What is the root cause and how can I get rid of the issue?

 

Many thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

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