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October 2011

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Sun, 23 Oct 2011 16:31:16 +0200
Content-Type:
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text/plain (187 lines)
Hi Bev,
You can check the graph for vapor pressure (psi) vs temp. of Werner's white
paper for PCBs.
I believe this graph is based on experimental measurements. I assume that
there are more factors (than the PV formula) influencing the vapor pressure
inside the PCB layers during reflow.
Reuven

On Sun, Oct 23, 2011 at 3:48 PM, Bev Christian
<[log in to unmask]>wrote:

> Reuven,
> I respectfully disagree.  Even if we assume a peak reflow temperature for
> eutectic tin/lead solder of only 205C and a high 260C for SAC305 the vapor
> pressure due to trapped air and/or moisture is still not going to double.
>
> P1V1=n1RT1
> P2V2=n2RT2
>
> R = a constant
> n1 = n2
> V1 = V2
>
> Leaving
> P1/P2 = T1/T2
>
> 300/P2 = (205+273)/260+273)
>
> P2 = 300*533/478
>
> P2 = 334  That is only an 11% increase.
>
> Not sure where the 300 came from in the first place, but no matter what
> number you start with, it does not double.
>
> Bev
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
> Sent: Sunday, October 23, 2011 5:03 AM
> To: [log in to unmask]
> Subject: Re: [TN] How do we determine the Maximum Acceptable Moisture
> Content (MAMC) for a board?
>
> Hi Garcia,
> You didn't mention the most important variable: the process technology, the
> vapor pressure (300 to 650 psi) of Lead free is more than double than
> Leaded
> process at the reflow peak temp.
> the MAMC for Leaded process should be 0.20% and for Lead Free 0.17%. (ref.
> Werner Engelmaier PCB FAB Notes).
> Reuven
>
> On Fri, Oct 21, 2011 at 8:31 PM, Garcia, Rigo (GSFC-300.0)[MANTECH SRS
> TECHNOLOGIES] <[log in to unmask]> wrote:
>
> > Hi everybody,
> >
> > Does anybody know how do we determine the Maximum Acceptable Moisture
> > Content (MAMC) for a board?
> >
> > I understand that IPC-1601 states that for most designs a MAMC between
> 0.1%
> > and 0.5% of moisture weight to resin weight is adequate. However, it does
> > not describe the basis to establish the range. I can think of many
> variables
> > that can affect this number like minimum pitch, voltage across, component
> > clearance, whether the board gets conformal coating or not, etc. I would
> > like to know if anybody knows of a safe method to determine the MAMC for
> a
> > given board.
> >
> > Paul... I can already see your "it depends" coming... :)!
> >
> > Thanks for the help!
> >
> > Rigo Garcia
> >
> > Sr. Quality Assurance Engineer
> > Workmanship Standards, Code 300
> > NASA, Goddard Space Flight Center
> > Greenbelt, MD  20771
> > Phone. (301) 286-6129
> > Fax.       (301) 286-6576
> >
> >
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>
>
> --
>
> Best Regards,
>
> *Reuven Rokah*
>
> Mobile: 972-52-60-120-18
> Tele-fax: 97239360688
> <http://www.rokah-technologies.com/>[log in to unmask]
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>


-- 

Best Regards,

*Reuven Rokah*

Mobile: 972-52-60-120-18
Tele-fax: 97239360688
<http://www.rokah-technologies.com/>[log in to unmask]
[log in to unmask]
www.rokah-technologies.com

**
This e-mail message is intended for the recipient only and contains
information which is CONFIDENTIAL and which may be proprietary of Rokah
Technologies. If you have received this transmission in error, please inform
me by e-mail, phone or fax, and then please delete all of the original files
and all other copies exist.


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