Fabien,
There have been other posts addressing your concerns since my last post.
Sorry for my delay in responding back as I was traveling all day
yesterday.
I would not be concerned in the higher P content you are reporting. If
anything higher P will resist corrosion which leads to black pad as was
pointed out in another post. You will need to determine if corrosion is
leading to your problem. Even with higher P you can still get corrosion.
One on the warning indicators would be a high gold deposit as the nickel
displacement during the gold immersion process in ENIG will produce some
corrosion. Excessive gold can cause excessive nickel corrosion.
Regards,
Bob Metcalf
Western Regional Manager
Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA
Mobile: 714-334-7667
e-mail: [log in to unmask]
Internet: www.atotech.com
Managing Director: Kuldip Johal
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USA Inc. and may contain CONFIDENTIAL OR PROPRIETARY BUSINESS INFORMATION.
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.
From: Fabien Guizelin <[log in to unmask]>
To: <[log in to unmask]>
Date: 10/17/2011 09:34 PM
Subject: Re: [TN] High Phosphorous content on ENIG PCB
Sent by: TechNet <[log in to unmask]>
Bob,
Thanks for the prompt support. Some more info :
On failed PWA, the communication between SDRAM and FLASH stops at -20oC.
The units boots and hang or just refuses to boot. Once temperature
reaches back -10oC, the unit operates again.
Dye&pry showed potential poor joints on the balls but nothing conclusive.
We conducted EDX on both failed PWA and fresh PCB. Both showed P-content
0.5% above IPC specs.
Black-pad originates from high Phosphorous content. But, how severe is
10.4%wt P-content ?
Regards,
Fabien
From: Bob METCALF [mailto:[log in to unmask]]
Sent: Tuesday, October 18, 2011 10:07
To: TechNet E-Mail Forum; Fabien Guizelin
Cc: [log in to unmask]
Subject: Re: [TN] High Phosphorous content on ENIG PCB
Fabien,
It would be helpful to understand the nature of the failure. You mention
it was a low temp failure. I don't understand what the failure is. Could
you please expand on this? As far as the P content being slightly about
10%, assuming it is a mid to high phos nickel, I wouldn't expect a
problem, but not knowing what has failed it would be difficult to
speculate.
Regards,
Bob Metcalf
Western Regional Manager
Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA
Mobile: 714-334-7667
e-mail: [log in to unmask]
Internet: www.atotech.com<http://www.atotech.com/>
Managing Director: Kuldip Johal
This e-mail and any attachments hereto are business documents of Atotech
USA Inc. and may contain CONFIDENTIAL OR PROPRIETARY BUSINESS INFORMATION.
Unauthorized disclosure and/or use of information contained in this
e-mail are prohibited. If you are not the intended recipient, you should
dispose of it and not use, disseminate or copy this message or any other
files transmitted with it.
[cid:[log in to unmask]]
.
From: Fabien Guizelin <[log in to unmask]>
To: <[log in to unmask]>
Date: 10/17/2011 05:42 PM
Subject: [TN] High Phosphorous content on ENIG PCB
Sent by: TechNet <[log in to unmask]>
________________________________
Hi all,
I am facing a PWA failure at low temperature. An EDX analysis revealed a
P-content of 10.4%wt which is outside the IPC-4552 1.2.1 specifications
(7-10%). The PCB has an ENIG finish.
Could I be facing black-pad ?
How severe is the 0.4%wt additional Phosphorous content ?
Regards,
Fabien
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