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October 2011

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Subject:
From:
Phil Bavaro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 18 Oct 2011 08:19:19 -0700
Content-Type:
text/plain
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text/plain (75 lines)
X,

As much as I hate to make assumptions, I believe you are talking about
underfill when you say BGA glue, correct?

There are "removeable" underfills on the market, but in those
applications, the BGA typically comes off first.

In a previous life, unacceptable underfill required removal of the BGA,
removal of the underfill, pad prep, component prep, BGA reball, BGA
re-installation, followed by acceptable underfill.

I had to develop specific instructions and processes for application of
underfill and spend a lot of time optimizing the process because
underfill removal without taking the BGA off was not a possibility.  

I will be interested to see if there is another way to skin this cat.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, October 18, 2011 6:05 AM
To: [log in to unmask]
Subject: [TN] BGA corner "L" shape glue removal process

Fellow TechNetters:

   What can one expect from a BGA glue removal process quality.   Glue
removal ONLY not the BGA.   The first glue application was not
acceptable.   What is to be expected?

"X"


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