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October 2011

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Tue, 18 Oct 2011 17:32:06 +0300
Content-Type:
text/plain
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text/plain (56 lines)
If defluxing is to be carried out, then the simple answer is to space 
the components out as much as real estate permits. As a general rule of 
thumb for most cleaning methods, the minimum would be half the combined 
height of two adjacent components, provided that there will be no 
shadowing in the cleaning machine. If one or both of the components has 
little substrate clearance or has a large surface area, then you may 
need to increase the spacing.

Brian

On 18/10/2011 15:12, prashant chopra wrote:
> Hi,
> �
> I am working on putting together a spacing guideline for the SMD Component spacing. I need help and suggestions as to what should be the standard and minimum spacing requirements for different packages of components?� Does anybody has any guideline document in place for this which can be shared?
> �
> example --- I would like to put in spacing required say between two 0603 components, or between a 1206 and 0805 packages or between a SOIC and nearby SMD component.
> �
> Your inputs and comments are valuable.
> �
> Thanks.
> �
> Regards
> Prashant
>
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