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October 2011

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Subject:
From:
"Upton, Shawn" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Upton, Shawn
Date:
Tue, 18 Oct 2011 12:35:53 +0000
Content-Type:
text/plain
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text/plain (74 lines)
Pick and place can get tighter; but rework considerations would tend to push out parts.

My rule of thumb: my layout software has an IPC footprint generator, and on most "short" components I live with whatever the automatically generated courtyard it makes.  Typically, just a silkscreen box, manually drawn around the component, makes enough space for manual soldering-the space taken up by the designator makes it even better.

I haven't come up yet with a good rule of thumb for taller components (relays for example).  The shorter the component the closer it can be to a tall one.  Often, if I can, I will use a "short" 1206 package between "tall" relays, as it acts as a natural spacer, keeping the tall relays apart-yet everything can be soldered.  But I don't know how to formulize a rule that is conditional on the height of the components in question.

Just my general observations from the mostly hand soldered boards that I design.

[One note: I've long been of the mindset that PCB layout engineers really ought to learn how to solder.  It'd keep some of the more basic mistakes from happening.]

Shawn Upton, KB1CKT
Test Engineer
Allegro MicroSystems, Inc
[log in to unmask]
603.626.2429/fax: 603.641.5336

From: prashant chopra [mailto:[log in to unmask]]
Sent: Tuesday, October 18, 2011 8:18 AM
To: Upton, Shawn
Subject: RE: [TN] SMD Component spacing guideline -- help required

pick and place

--- On Tue, 18/10/11, Upton, Shawn <[log in to unmask]> wrote:

From: Upton, Shawn <[log in to unmask]>
Subject: RE: [TN] SMD Component spacing guideline -- help required
To: "TechNet E-Mail Forum" <[log in to unmask]>, "prashant chopra" <[log in to unmask]>
Date: Tuesday, 18 October, 2011, 5:46 PM
Hand solder or pick and place?

Shawn Upton, KB1CKT
Test Engineer
Allegro MicroSystems, Inc
[log in to unmask]<[log in to unmask]" target="_blank">http:[log in to unmask]>
603.626.2429/fax: 603.641.5336


-----Original Message-----
From: TechNet [mailto:[log in to unmask]<[log in to unmask]" target="_blank">http:[log in to unmask]>] On Behalf Of prashant chopra
Sent: Tuesday, October 18, 2011 8:12 AM
To: [log in to unmask]<[log in to unmask]" target="_blank">http:[log in to unmask]>
Subject: [TN] SMD Component spacing guideline -- help required

Hi,

I am working on putting together a spacing guideline for the SMD Component spacing. I need help and suggestions as to what should be the standard and minimum spacing requirements for different packages of components?  Does anybody has any guideline document in place for this which can be shared?

example --- I would like to put in spacing required say between two 0603 components, or between a 1206 and 0805 packages or between a SOIC and nearby SMD component.

Your inputs and comments are valuable.

Thanks.

Regards
Prashant



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