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October 2011

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From:
Fabien Guizelin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Fabien Guizelin <[log in to unmask]>
Date:
Tue, 18 Oct 2011 04:30:55 +0000
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Bob,

Thanks for the prompt support.    Some more info :
On failed PWA, the communication between SDRAM and FLASH stops at -20oC.   The units boots and hang or just refuses to boot.   Once temperature reaches back -10oC, the unit operates again.
Dye&pry showed potential poor joints on the balls but nothing conclusive.
We conducted EDX on both failed PWA and fresh PCB.  Both showed P-content 0.5% above IPC specs.

Black-pad originates from high Phosphorous content.   But, how severe is 10.4%wt P-content ?

Regards,
Fabien


From: Bob METCALF [mailto:[log in to unmask]]
Sent: Tuesday, October 18, 2011 10:07
To: TechNet E-Mail Forum; Fabien Guizelin
Cc: [log in to unmask]
Subject: Re: [TN] High Phosphorous content on ENIG PCB

Fabien,

It would be helpful to understand the nature of the failure. You mention it was a low temp failure. I don't understand what the failure is. Could you please expand on this? As far as the P content being slightly about 10%, assuming it is a mid to high phos nickel, I wouldn't expect a problem, but not knowing what has failed it would be difficult to speculate.

Regards,

Bob Metcalf
Western Regional Manager

Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA

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From:        Fabien Guizelin <[log in to unmask]>
To:        <[log in to unmask]>
Date:        10/17/2011 05:42 PM
Subject:        [TN] High Phosphorous content on ENIG PCB
Sent by:        TechNet <[log in to unmask]>
________________________________



Hi all,
I am facing a PWA failure at low temperature.  An EDX analysis revealed a P-content of 10.4%wt which is outside the IPC-4552 1.2.1 specifications (7-10%).   The PCB has an ENIG finish.
Could I be facing black-pad ?
How severe is the 0.4%wt additional Phosphorous content ?
Regards,
Fabien


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