Fabien,

It would be helpful to understand the nature of the failure. You mention 
it was a low temp failure. I don't understand what the failure is. Could 
you please expand on this? As far as the P content being slightly about 
10%, assuming it is a mid to high phos nickel, I wouldn't expect a 
problem, but not knowing what has failed it would be difficult to 
speculate.

Regards,

Bob Metcalf
Western Regional Manager

Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA

Mobile: 714-334-7667
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Managing Director: Kuldip Johal

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From:   Fabien Guizelin <[log in to unmask]>
To:     <[log in to unmask]>
Date:   10/17/2011 05:42 PM
Subject:        [TN] High Phosphorous content on ENIG PCB
Sent by:        TechNet <[log in to unmask]>



Hi all,
I am facing a PWA failure at low temperature.  An EDX analysis revealed a 
P-content of 10.4%wt which is outside the IPC-4552 1.2.1 specifications 
(7-10%).   The PCB has an ENIG finish.
Could I be facing black-pad ?
How severe is the 0.4%wt additional Phosphorous content ?
Regards,
Fabien


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