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October 2011

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:
Mon, 17 Oct 2011 13:54:57 -0400
Content-Type:
text/plain
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text/plain (127 lines)
Right up there with the vid of reflow using a can of Sterno . . . that was
on an X-box too. 
Guy

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Knudsen
Sent: Monday, October 17, 2011 1:32 PM
To: [log in to unmask]
Subject: Re: [TN] Reflow of BGA

The last comment in this video is:
"PRAY"
http://www.dailymotion.com/video/x7xcuj_xbox-360-bga-reflow_tech
-Chris

On 10/17/2011 1:21 PM, David Tremmel wrote:
> Hello Patrick,
>
> Do you really want to fix it or do you want to experiment?
>
> Using a soldering iron is not a good idea because the heat will never
> transfer from the top of the component to all of the spheres or the PCB.
>
> If you were to use hot-air and a thermocouple you might have success since
> an SODIMM has such a low mass and the memory BGAs are so thin.
>
> Then again, if you don't bake-out the moisture, you might have latent
> component and/or PCB failures.
>
>
> Thank you,
>
> David Tremmel
> 872 S. Milwaukee Ave, #253
> Libertyville, IL 60048
> 847 858-5540 - Phone
> www.ValuRecovery.com
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Goodyear, Patrick
> Sent: Monday, October 17, 2011 12:10 PM
> To: [log in to unmask]
> Subject: [TN] Reflow of BGA
>
> Ok gang, I'm stretching my limits here.
>
> Does anyone have experience with hand reflow of BGA?    I have never tried
> it.    Does one use a hot jet or can it be done with the iron to the
> component.
> Most notably on a SODIMM, one of the memory chips has a bad connection,
> looks like 3 rows per side of 8 per row.
>
> Pat
>
>
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