Hi Pat,

You never hand solder a BGA. There are so many issues related to it that you will likely run into reliability problems (e.g. infant mortality). We use something similar called CCGAs (solder columns instead of solder balls) which provide a better level of long-term reliability than BGAs.

Check this document if you want to learn about the thermal and process issues of soldering these components (BGAs have very similar issues): https://www-01.ibm.com/chips/techlib/techlib.nsf/techdocs/630AFA7BD7DE3FED87256C0100558D50/$file/ccga.pdf

I hope this helps.

Rigo

Sr. Quality Assurance Engineer
Workmanship Standards, Code 300 
NASA, Goddard Space Flight Center
Greenbelt, MD  20771
Phone. (301) 286-6129
Fax.       (301) 286-6576


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Goodyear, Patrick
Sent: Monday, October 17, 2011 1:10 PM
To: [log in to unmask]
Subject: [TN] Reflow of BGA

Ok gang, I'm stretching my limits here.

Does anyone have experience with hand reflow of BGA?    I have never tried it.    Does one use a hot jet or can it be done with the iron to the component.
Most notably on a SODIMM, one of the memory chips has a bad connection, looks like 3 rows per side of 8 per row.

Pat


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