Hello Patrick,

Do you really want to fix it or do you want to experiment?

Using a soldering iron is not a good idea because the heat will never
transfer from the top of the component to all of the spheres or the PCB.

If you were to use hot-air and a thermocouple you might have success since
an SODIMM has such a low mass and the memory BGAs are so thin.

Then again, if you don’t bake-out the moisture, you might have latent
component and/or PCB failures.


Thank you,
 
David Tremmel
872 S. Milwaukee Ave, #253
Libertyville, IL 60048
847 858-5540 - Phone
www.ValuRecovery.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Goodyear, Patrick
Sent: Monday, October 17, 2011 12:10 PM
To: [log in to unmask]
Subject: [TN] Reflow of BGA

Ok gang, I'm stretching my limits here.

Does anyone have experience with hand reflow of BGA?    I have never tried
it.    Does one use a hot jet or can it be done with the iron to the
component.
Most notably on a SODIMM, one of the memory chips has a bad connection,
looks like 3 rows per side of 8 per row.

Pat


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