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October 2011

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Mon, 17 Oct 2011 13:15:44 -0400
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Thant's an easy one Pat: you don't hand reflow BGAs as you have no control of what is happening.



Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] 
W | www.digico.cc

N'imprimer que si nécessaire - Print only if you must

-----Message d'origine-----
De : Goodyear, Patrick [mailto:[log in to unmask]] 
Envoyé : October-17-11 1:10 PM
À : [log in to unmask]
Objet : [TN] Reflow of BGA

Ok gang, I'm stretching my limits here.

Does anyone have experience with hand reflow of BGA?    I have never tried it.    Does one use a hot jet or can it be done with the iron to the component.
Most notably on a SODIMM, one of the memory chips has a bad connection, looks like 3 rows per side of 8 per row.

Pat


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