Michael,
The first question I would ask is are the ICs with oxidation solderable or not? If they are solderable then I would use them without pre-tinning them. If they aren't solderable I would have then pre-tinned with SnPb rather than Pb-Free.
Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Forrester, Michael (H USA)
Sent: Friday, October 14, 2011 8:58 AM
To: [log in to unmask]
Subject: [TN] Pre-tinning Oxidized IC Leads
We have about 5000 lead -free surface mount 8 pin Dip/so ICs with
oxidation on the leads. The will be used on a tin/lead assembly. The
plan it send the parts out to have them pre-tinned.
We have the option of pre-tinning with lead-free or tin/lead solder.
The lead-free tinning is about $1.20/part and the leaded is about $0.70.
My thinking is that since we are
going to use tin/lead to attach it to the PCB why spend the extra $2500
to get lead free. The vendor is pushing that since the parts where
originally lead free we should pre-tin them lead free.
What I'm not sure is, is ther a real reason to pre-tin the parts using
lead free solder or is the vendor just trying to make more money? I
then started to think, is this the best method to get
oxidized parts soldererable? Is there a better way (ultasonic cleaning,
etc.)? THank you in advance.
Best Regards,
Michael Forrester
Sr. Product Engineer
Siemens Healthcare Diagnostics
101 Silvermine Rd.
Brookfield, CT 06804
PH: (203) 740-6452
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