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October 2011

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Subject:
From:
"Forrester, Michael (H USA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Forrester, Michael (H USA)
Date:
Fri, 14 Oct 2011 08:58:08 -0400
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We have about 5000 lead -free surface mount 8 pin Dip/so ICs with
oxidation on the leads.  The will be used on a tin/lead assembly.  The
plan it send the parts out to have them pre-tinned.
We have the option of pre-tinning with lead-free or tin/lead solder.
The lead-free tinning is about $1.20/part and the leaded is about $0.70.
My thinking is that since we are
going to use tin/lead to attach it to the PCB why spend the extra $2500
to get lead free.  The vendor is pushing that since the parts where
originally lead free we should pre-tin them lead free.
What I'm not sure is, is ther a real reason to pre-tin the parts using
lead free solder or is the vendor just trying to make more money?  I
then started to think, is this the best method to get
oxidized parts soldererable?  Is there a better way (ultasonic cleaning,
etc.)?  THank you in advance.
 
Best Regards,
 
Michael Forrester
Sr. Product Engineer
 
Siemens Healthcare Diagnostics
101 Silvermine Rd.
Brookfield, CT  06804
PH: (203) 740-6452
 

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