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Date: | Thu, 27 Oct 2011 21:20:38 +0000 |
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IPC-7525B<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=ebcea9e1-4cfe-e011-8203-00155d05285c>
Stencil Design Guidelines
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included. 14 pages. Released October 2011.
Hard copy:
IPC Member Price: $31.00
Nonmember Price: $62.00
Additional electronic formats are available. Please click through the link above for pricing and more information on the standard, including a link to the table of contents.
IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing [log in to unmask]<mailto:[log in to unmask]> within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.
Kimberly Sterling, CAE
Vice President, Marketing & Communications
IPC - Association Connecting Electronics Industries
3000 Lakeside Dr. Suite 309-S
Bannockburn, IL 60015
Tel 847-597-2805
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