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Date: | Fri, 14 Oct 2011 21:27:55 -0500 |
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Hi Michael - if the components are going to be used in a tin/lead process
and you are going to preprocess them to re-establish their solderability,
then I vote with George to re-tin them with tin/lead solder. A tin/lead
surface finish in a tin/lead soldering process is a matched material set
with is always the optimal situation.
Dave Hillman
Rockwell Collins
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"Forrester, Michael (H USA)" <[log in to unmask]>
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[TN] Pre-tinning Oxidized IC Leads
We have about 5000 lead -free surface mount 8 pin Dip/so ICs with
oxidation on the leads. The will be used on a tin/lead assembly. The
plan it send the parts out to have them pre-tinned.
We have the option of pre-tinning with lead-free or tin/lead solder.
The lead-free tinning is about $1.20/part and the leaded is about $0.70.
My thinking is that since we are
going to use tin/lead to attach it to the PCB why spend the extra $2500
to get lead free. The vendor is pushing that since the parts where
originally lead free we should pre-tin them lead free.
What I'm not sure is, is ther a real reason to pre-tin the parts using
lead free solder or is the vendor just trying to make more money? I
then started to think, is this the best method to get
oxidized parts soldererable? Is there a better way (ultasonic cleaning,
etc.)? THank you in advance.
Best Regards,
Michael Forrester
Sr. Product Engineer
Siemens Healthcare Diagnostics
101 Silvermine Rd.
Brookfield, CT 06804
PH: (203) 740-6452
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