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October 2011

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Subject:
From:
"Patten, Chuck" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 14 Oct 2011 14:38:50 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (150 lines)
Remember this thread and our caution about assigning tin whiskers as a
viable culprit?  Looks like Toyota still has a real lead-free problem...

http://www.calce.umd.edu/articles/abstracts/2011/Tin_whisker_Toyota_thro
ttle_abstract.html

cheers,
chuck...



-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Bob Landman
Sent: Wednesday, March 03, 2010 9:06 AM
To: [log in to unmask]
Subject: [LF] Has Toyoda transitioned to lead free manufacturing?

The question has been asked - is there evidence that Toyota has gone
lead-free? I found this discussion on SMTNET that discusses the topic
(we aren't the only ones debating this subject)

http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Th
read_ID=14597&#Message61142

Toyota developed their own lead free alloy
http://sciencelinks.jp/j-east/article/200016/000020001600A0589899.php

Quote" Several engineers are readying the Toyota recall press daily to
see whether Toyota - an early adapter of lead-free solder - is the first
casualty." unquote
http://retroworks.blogspot.com/2010/02/leadfree-solder-rohs-rumors.html

Quote "January 2001, we inaugurated our own company-wide lead free
project, starting activities and efforts to eliminate lead thoroughly"
unquote
http://www.toyota-industries.com/csr/environment/product/erectoronic_02.
html

Transforming Compliance into a Competitive Strategy
http://www.internetviz-newsletters.com/cincom/e_article000667816.cfm?x=,

(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=61176)  

Here's the details on their solder:

"A highly reliable Sn-Ag-Bi-In-Cu lead-free solder alloy was developed
by improving the melting property, the wettability and the mechanical
property of the Sn-Ag solder alloy which has a high thermal fatigue
resistance due to the addition of bismuth, indium and copper. The
optimum alloy composition for the Sn matrix is 2.5-3.0mass%Ag,
3.0mass%Bi, 1.0mass%In and 0.2-0.5mass%Cu. The additional elemental
bismuth contributed to the control of the solidus and liquidus
temperatures and the improvement of the wettability and tensile
strength. Indium contributed to the control of the solidus and liquidus
temperatures and the improvement of wettability. Copper contributed to
the improvement of the ductility which is degraded by the addition of
bismuth. In comparison with the Sn-3.5Ag eutectic solder, this new
lead-free solder alloy has a 19.DEG.C. lower solidus temperature,
6-7.DEG.C. lower liquidus temperature, 4% higher spreading factor and
200% higher tensile strength. Its elongation is equal to and above
Sn-3.5Ag at 125.DEG.C. though it is half as long as that of Sn-3.5Ag at
25.DEG.C.. It was confirmed that this new lead-free solder joint has a
high thermal fatigue resistance and the same electrochemical reliability
in comparison with the conventional Sn-37Pb solder joint. (author
abst.)"

I found the following report on their corporate website which is not
clear about the percentage of products which are lead free.  Of course,
the components we all buy, are mostly lead-free tin plated.
http://www.toyota-industries.com/csr/library/pdf2003/P18-25.pdf

"Under the European Union's end-of-life vehicle (ELV) directive*, the
use of lead, mercury, cadmium and hexavalent
chromium will be banned from all vehicles sold in Europe starting from
July 2003. In response to the ELV directive, Toyota
Industries' Product Technology Subcommittee has established objectives
aimed at reducing the company's reliance on
substances of concern in all of its business activities including its
non-vehicle related businesses.
During FY 2002, Toyota Industries made changes to the design of parts
that previously contained lead, cadmium or
hexavalent chromium and switched to using alternative chemical
substances. Toyota Industries also asked its suppliers to
submit data regarding the inclusion and quantity of banned substances in
materials and parts supplied to the company,
and also requested that its suppliers submit plans for eventually
phasing out the use of banned substances. In addition,
Toyota Industries revised its in-house guidelines for substances of
concern to reflect the policy of banning certain
designated chemical substances."

"Lead-Free Circuit Boards

Lead contained in solder used in circuit boards has been
noted for polluting the environment when it is not properly
disposed of. Consequently, Toyota Industries is trying to
switch to lead-free solder in its circuit boards for its industrial
machinery, automobiles and textile machinery products.
When designing circuit boards with lead-free solder,
Toyota Industries had to overcome various issues such as the
high melting point of lead-free solder, which made it difficult
to control soldering temperatures while ensuring that parts
could stand the heat. However, Toyota Industries was
successful in overcoming these issues and in January 2003
began producing lead-free circuit boards for use in the
displays for one of its electric reach truck models."


Regards,

Bob Landman
H&L Instruments, LLC


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