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Date: | Tue, 11 Oct 2011 10:29:14 -0400 |
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Pete,
I agree. Sometime it is less of an agenda and more of a case of never having reflowed these parts.
My observation with QFNs has suggested having a good .5 to 1.0 mm of pad outside the package. It acts like a solder reservoir area allowing solder to flow out from under the leads as the component reflows and settles down. So often I see suggest QFN footprint with no such area.
Just a non-qualified observation.
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete
Sent: Tuesday, October 11, 2011 9:32 AM
To: [log in to unmask]
Subject: Re: [TN] [DC] QFN layout
I never trust the manufacturer's suggested footprint, always do my own calculations. They have a different agenda than I need to have. Lately, though, I'm finding their footprints much closer to mine.
Pete
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