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Date: | Mon, 17 Oct 2011 13:15:44 -0400 |
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Thant's an easy one Pat: you don't hand reflow BGAs as you have no control of what is happening.
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask]
W | www.digico.cc
N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Goodyear, Patrick [mailto:[log in to unmask]]
Envoyé : October-17-11 1:10 PM
À : [log in to unmask]
Objet : [TN] Reflow of BGA
Ok gang, I'm stretching my limits here.
Does anyone have experience with hand reflow of BGA? I have never tried it. Does one use a hot jet or can it be done with the iron to the component.
Most notably on a SODIMM, one of the memory chips has a bad connection, looks like 3 rows per side of 8 per row.
Pat
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