TGASIA Archives

October 2011

TGAsia@IPC.ORG
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TGAsia <[log in to unmask]>
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TGAsia <[log in to unmask]>, 黄艳斌 <[log in to unmask]>
Date:
Wed, 19 Oct 2011 03:26:23 +0000
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Asia Committe Task Group Forum <[log in to unmask]>, Rong XIAO <[log in to unmask]>
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Subject:
答复: [TGAsia] 维修BGA之前对PCBA的烘烤条件
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Rong XIAO <[log in to unmask]>
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请参考IPC J-STD-033





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发件人: TGAsia [mailto:[log in to unmask]] 代表 黄艳斌

发送时间: 2011年10月14日 10:41

收件人: TGAsia

主题: [TGAsia] 维修BGA之前对PCBA的烘烤条件



Hi 各位专家,

请问各位是否知道什么规范里有针对BGA维修前, 对PCBA的烘烤条件.感谢!



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