Sender: |
|
X-To: |
|
Date: |
Wed, 12 Oct 2011 09:05:10 -0500 |
Reply-To: |
|
Message-ID: |
|
Subject: |
|
From: |
|
X-cc: |
|
In-Reply-To: |
|
Content-Type: |
text/plain; charset="US-ASCII" |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
Hi Steve - yes, I agree! As Doug always says "it depends" and in this
case its the specific type of component technology. We have done some
testing of open cavity components which withstood the ultrasonic cleaning
without damage but as you detailed, investigation is needed to be sure
that no issue arise.
Dave
Steven Creswick <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
10/12/2011 08:10 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Steven Creswick <[log in to unmask]>
To
<[log in to unmask]>
cc
Subject
Re: [TN] Wire soldering question - Utrasonics discussion
Dave,
If there were any cavity packages, such as mechanical relays, HYBRIDS,
CPU's, crystals, etc on the board they could indeed be susceptible to
possible mechanical damage caused by the ultrasonics. I have observed the
results of individuals placing SEALED hybrids [cavity style packages] into
ultrasonic cleaners with devastating results to the wire bonds. Placing
the
same hybrids into the ultrasonic cleaner in an un-sealed state did not
affect the wire bonds [but prove out one's own process to be sure].
Conversely, if the devices are plastic encapsulated PEMs, with no internal
cavities, they are essentially immune from any reasonable ultrasonic
exposure that I can imagine.
If there are cavities - tread with caution.
No cavity, total encapsulation - typically safe!
My 10 cents
Steve Creswick
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, October 12, 2011 8:14 AM
To: TechNet E-Mail Forum; Amol Kane
Cc: [log in to unmask]
Subject: Re: [TN] Wire soldering question - Utrasonics discussion
Hi Amol - you can call it a myth or just old tribal knowledge but for many
years there was (and still is in some segments) the idea that ultrasonics
-
either soldering or cleaning - will damage the die or the wirebonds in
components. There are a number of good industry publish investigations
that
show ultrasonics can be applied for in both the cleaning and soldering
applications safely without causing component damage provided you do
sufficient process qualification. I am not a fan of ultrasonic soldering
as
I can ultrasonically solder a toothpick - the solder sticks mechanically
and
not because I made a metallurgical interface. But, ultrasonic soldering is
a
viable process provided attention is paid to making metallurgically sound
solder joints. Ultrasonics have wide application in cleaning processes.
Other TechNetters can provide better information on that aspect than I.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|