Good morning again !

 

This is the second subject for which I need your help today. During previous
work -when I qualified lead free assembly years ago- several PCB finitions
was compared. Among the finitions we tested, HAL Sn100C was rejected because
of reflow issues using SAC305 solder paste. 

 

Problems were lack of solderability. I assumed that the reason was because
of the difference between liquidus of Sn100c in comparaison with SAC305. We
didn't make a lot of work to solve that as we head quickly to ENIG and I
finally rejected Sn100C. until this week when a customer request Sn100C for
cost reason.

 

So I would appreciate testimony of technetters that use successfully Sn100C
as PCB finition with SMD process as well as troubleshooting feedback
regarding this process.

 

Regards,

 

Cedric

 <http://www.inovelec-group.com> www.inovelec-group.com

 

 



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